Linker Tel

Engineering Disciplines

Hardware & Silicon
Areas of Expertise

Autonomous personal technology requires simultaneous innovation across silicon topology, optical physics, thermodynamics, and real-time firmware. Linker Tel focuses engineering resources on the primary bottlenecks that limit local computing density.

  • Heterogeneous SoC Architecture
  • On-Die Neural Matrix Acceleration
  • Low-Bit Model Quantization (INT4 / FP8)
  • MIPI CSI-2 Direct Sensor Bus
  • Multi-Spectral & Depth Sensing
  • Phase-Change Vapor Dissipation
  • Sub-Watt Contextual Sensor Hubs
  • Low-Latency Spatial Mesh RF
  • Conductive Magnesium Chassis Design
  • Zero-Copy Memory Interconnect

Core Engineering Programs

Neural Matrix Silicon & Acceleration

Custom accelerator blocks engineered specifically for matrix-vector multiplications, low-bit quantized transformer weights (INT4, FP8), and dynamic activation caching. Designed to sustain high token throughput inside a handheld power envelope without thermal degradation.

ASIC Architecture · Microcode Verification · Memory Fabric

Multi-Spectral Optical Perception Pipeline

Co-engineering optical sensor silicon with neural perception engines. High-bandwidth image sensor interfaces route raw Bayer and multi-spectral streams directly into accelerator SRAM, enabling real-time visual scene understanding with microsecond latency.

Optical Engineering · ISP-to-NPU Direct Bus · Sensor Packaging

Continuous Sub-Watt Context Engine

Ultra-low-power micro-controllers and custom sensor hub silicon that operate persistently below 15mW. Continuously processes acoustic, spatial, and inertial cues to wake up primary neural execution cores only when active intent is detected.

Ultra-Low-Power Firmware · Sensor Fusion · Power Island Gating

Phase-Change Thermodynamic Chassis

Thermal management engineered into the structural chassis. Custom vapor chambers and isotropic graphite heat spreaders conduct heat away from the silicon package across the structural magnesium frame, keeping touch surface temperatures strictly within ergonomic limits.

Thermal Simulation · Conductive Metallurgy · Thin-Film Vapor Chambers

Ultra-Low-Latency Spatial RF Interconnect

Proprietary short-range wireless protocol delivering sub-15ms round-trip synchronization between handheld reference hardware and spatial accessories. Operates with minimum transmission duty cycles to maximize standby battery life.

Antenna Array Design · Baseband Firmware · Spatial Telemetry

Subsystem Convergence

Unified Physical & Silicon Architecture

Performance at the edge is dictated by the weakest physical link. We co-design the silicon packaging, PCB stackup, antenna placement, and chassis metallurgy as a unified system.

Sensor-to-accelerator signal path SENSOR multi-spectral SRAM accelerator-local NPU ARRAY matrix-vector FABRIC unified memory DIRECT MIPI CONTEXT always-on · gating wake thermal path to chassis SYSTEM-IN-PACKAGE ENVELOPE Sensor-to-accelerator signal path SENSOR multi-spectral SRAM accelerator-local NPU ARRAY matrix-vector FABRIC unified memory DIRECT MIPI CONTEXT always-on · gating WAKE TO CHASSIS
Signal path — sensor into accelerator SRAM without a main-memory round trip, with wake-up gated by the always-on context engine

Supply Chain & Manufacturing

Strategic Partner Engagement

Linker Tel is actively qualifying relationships with global semiconductor foundries, component suppliers, optical manufacturers, and Tier-1 contract manufacturers.

We work closely with engineering teams at partner organizations to evaluate manufacturing tolerances, advanced packaging yields, and volume component availability.

Foundry Nodes

Advanced sub-4nm FinFET / GAA processes for custom compute and NPU silicon; mature RF and mixed-signal processes for sensor front-ends.

Advanced Packaging

System-in-Package (SiP), 2.5D interposer integration, and ultra-high-density interconnect substrates for compact form-factor routing.

Optical Modules

Custom compact lens barrels, high-efficiency optical coatings, multi-spectral filters, and integrated micro-actuators.

Precision Metallurgy

Multi-axis CNC milling, thixomolding of magnesium alloys, micro-laser welding, and advanced physical vapor deposition (PVD) surface treatments.

Contact Engineering Qualification Corporate Directory