Linker Tel

Engineering Opportunities

Engineering at the
Physical Limits

Linker Tel is expanding its core engineering laboratory across silicon architecture, embedded firmware, thermal physics, and edge machine learning. We seek engineers who prioritize hardware execution, deterministic performance, and tangible reference systems over hypothetical software abstractions.

Active Engineering Disciplines

Silicon & NPU Micro-Architecture

Designing custom compute blocks for low-bit matrix multiplication, on-die SRAM interconnects, and register-level power gating inside tight thermal envelopes.

ASIC Architecture · RTL Design · UVM Verification

Low-Level Firmware & Sensor Hubs

Developing bare-metal C/C++ firmware and microkernel drivers for always-on sensor aggregation, target sub-100µs wakeups, and DMA optical pipelines.

Embedded C/C++ · RTOS · MIPI CSI-2 Drivers · Power Management

Thermal, Materials & Structural Architecture

Solving continuous conductive heat dissipation in target sub-7mm magnesium enclosures using thin-film vapor chambers and structural graphite spreading.

Thermal CFD Simulation · CNC Metallurgy · DFM · Environmental Stress

Edge Model Quantization & Compilers

Developing compiler backends and quantization routines to execute multimodal models within INT4/FP8 weight envelopes with minimal perceptual loss.

MLIR / TVM Compilers · Quantization (PTQ/QAT) · Kernel Optimization

RF Front-End & Spatial Interconnect

Engineering integrated multi-band antenna systems and low-duty-cycle spatial wireless protocols for ultra-low-power peripheral synchronization.

Antenna Design · Sub-6GHz / UWB · Regulatory Compliance

Patent Prosecution & IP Strategy

Working directly with hardware and silicon inventors to draft, file, and defend foundational international patent applications.

USPTO / EPO Prosecution · Hardware Patent Drafting · Technical IP Defense

Application Protocol

Submit Engineering Credentials

To apply, send your resume or technical CV in PDF format to careers@linker.tel.

Please specify your primary technical discipline in the email subject line (e.g., Application — Silicon & NPU Micro-Architecture). Include brief summaries of past hardware tape-outs, firmware repositories, or physical engineering projects you have built and can discuss.

Because our reference hardware program is confidential, early technical evaluations focus on engineering fundamentals and problem-solving. In-depth architecture reviews follow mutual NDA execution.

  1. 01

    Submit credentials

    Resume or technical CV in PDF to careers@linker.tel, with your primary discipline in the subject line.

  2. 02

    Fundamentals review

    Early evaluation focuses on engineering fundamentals and problem-solving, not on disclosed architecture.

  3. 03

    Mutual NDA

    Executed before any in-depth discussion of the platform or its internals.

  4. 04

    Architecture review

    Detailed technical discussion with the engineering team in your discipline.

Email careers@linker.tel Review Platform Architecture

Linker Tel Corp is an equal opportunity employer. Qualified applicants receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or veteran status.